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All Categories > Heat Sinks > Liquid Stir-welded Chill Plate > Item # CHW007-MXQ-01  
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Item # CHW007-MXQ-01, Liquid Stir-welded Chill Plate

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CH_007-MXQ-01

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Features
  • High performance level optimal for cooling large IGBT modules in inverter assemblies.
  • Ultra-low thermal resistance for high wattage heat dissipation
  • Low pressure drop for reduced system cost
  • Low cost proven aluminum solution with performance comparable to copper based solutions
  • Compatible with industry accepted coolants
  • Metallurgical seal for robustness and a high pressure rating
  • Custom designs available.

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 Specifications  

Length

202 mm

Width

130 mm

Thickness

20 mm

Thermal Resistance

0.008 ºC/W

Compatible with

VISHAY Dual Int-A-Pak, VISHAY Dual Int-A-Pak (Low Profile), POWEREX 62mm Package, FUJI Semiconductor M127, M234, M235, INFINEON 62mm Package, SEMIKRON SEMiTRANS Case D56

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